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Home Material Sciences Mechanically Driven Method for 2D and 3D Nanofabrication of Electronic Devices by Self-Assembly

Mechanically Driven Method for 2D and 3D Nanofabrication of Electronic Devices by Self-Assembly

Description

Evolution to more compact electronic systems causes appearance of the novel different nanolithography techniques investigated by many research teams. As one of the novel nanofabrication method, self-assembly is intensively investigated recently.

The new self-assembly method of rectangular and rhombic grids on single crystalline Al-thin plates under constrained cyclic mechanical tension is reported. The nanoextrusions and nanointrusions produced in this way evolve from initial random to regular 2D and 3D arrangements. The 2D regular continuous-solid rectangular grid (“tweed”) was observed at micro and sub-micro scales with the typical grid spacing of 500 nm and extrusion height of 500 nm.

After continuation of the cyclic mechanical tension, the 3D discontinuous rhombic grid of voids (“pullover”) was created at micro and macro scales with the typical grid spacing distributed in the range of 1-200 μm, extrusion height of 1-100 μm, and much wider distribution of void sizes of 0,1-100 μm. This evolution could allow for the new mechanically driven method for nanofabrication of 2D and 3D electronic devices by self-assembly controlled by the chemical composition, the number of cycles, amplitude of the applied mechanical stress, initial roughness, etc.

Innovative Aspect and Main Advantages

The most current fabrication methods of microelectronic devices are carried out by conventional parallel technique of photolithography (for feature sizes greater than 300 nm) and serial technique of electron beam lithography (for feature sizes between 300 and 30 nm). The novel nanolithography techniques will be necessary to create the features with sizes smaller than 30 nm.

Serial scanning probe surface methods are very powerful, but have two crucial limits: high price and low rate. Despite the great advances in building devices with thousands tips at the same time, they hardly satisfy the mass production demand with commercially affordable prices. The novel self-assembly method proposed here can provide the new paths to mass-production of cheap 2D and 3D electronic nanoscale devices

Areas of Application

The mechanically driven self-assembly is suitable for 2D and 3D nanofabrication of electronic devices in nano and sub-micro and micro electronics, high sensitive membranes and detectors of chemical and biological agents (explosives, pollutants, warfare, etc.), other sensors and actuators.


Fig. 1 2D continuous-solid rectangular sub-micro grid (“tweed”)
(A – SEM, B – AFM, D and E – their correspondent Fourier transforms);
3D discontinuous rhombic grid of voids (“pullover”)
(C – SEM, F – Fourier transform)

Stage of Development

Development phase - laboratory tested, feasibility study.

Contact Details

Dr. Yuri Gordienko,
G.V.Kurdyumov Institute of Metal Physics of the National Academy of Sciences of Ukraine,
36, Vernadsky Blvd, Kyiv UA-03680 UKRAINE
Tel.:+380 44 4249556, +380 66 1469714 (mobile),
Fax: +380 44 4242561
E-mail: This e-mail address is being protected from spambots. You need JavaScript enabled to view it

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